| 5363 |
40 |
Gold-Plated Nickel |
200 |
356 – 392 (180 – 200), 10-15 secs |
For connecting copper on polyimide flex to PCB and flex-to-flex. Excellent high temperature reliability. Fast bond time. |
| 5552R |
19 |
Gold-Plated Nickel w/Polymer Core |
<100 |
338 – 374 (170 – 190), 20-30 secs |
For connecting copper on polyimide flex-to-glass. |
| 7303 |
74 |
Silver-Coated Glass |
500 |
275 – 302 (135 – 150), 20-30 secs |
For connecting silver ink on polyester or copper on polyimide flex-to-PCB and flex-to-flex. Excellent resistance to low temps and solvents. |
| 7313 |
63 |
Silver-Coated Glass |
500 |
275 – 302 (135 – 150), 5-10 secs |
For connecting silver ink on polyester or copper on polyimide flex-to-PCB and flex-to-flex. Bonds at low temperatures; compatible with automated processes. Stored at room temperature. |
| 8794 |
60 |
Silver-Coated Filler |
1000 |
302 – 320 (150 – 160), 3-5 secs |
Good adhesion to substrates such as ABS, PVC and Melinex®, commonly used to bond and connect micromodules to antennae for Smart Card applications. Also ideal for any applications where fast bond times and reliable connections are required. Stored at room temperature. |
| 9703 |
50 |
Silver-Coated Nickel |
1000 |
59 – 158 (15 – 70), PSA |
Low outgassing version of 9705. |
| 9705 |
50 |
Silver-Coated Nickel |
1000 |
59 – 158 (15 – 70), PSA |
Good adhesion; reworkable. For connecting/bonding/grounding flex circuits, printed circuits boards, EMI/RFI shields & gaskets; PSA attachments at room temp. Not recommended for extreme high or low temps. Standard outgassing. |
