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Materials » 3M™ Electronics » 3M™ Anisotropic Conductive Film (ACF) Adhesives

Product Adhesive Thickness μ Particle Type Minimum Pitch μ Bonding Conditions °F (°C) Applications/Notes
5363 40 Gold-Plated Nickel 200 356 – 392 (180 – 200), 10-15 secs For connecting copper on polyimide flex to PCB and flex-to-flex. Excellent high temperature reliability. Fast bond time.
5552R 19 Gold-Plated Nickel w/Polymer Core <100 338 – 374 (170 – 190), 20-30 secs For connecting copper on polyimide flex-to-glass.
7303 74 Silver-Coated Glass 500 275 – 302 (135 – 150), 20-30 secs For connecting silver ink on polyester or copper on polyimide flex-to-PCB and flex-to-flex. Excellent resistance to low temps and solvents.
7313 63 Silver-Coated Glass 500 275 – 302 (135 – 150), 5-10 secs For connecting silver ink on polyester or copper on polyimide flex-to-PCB and flex-to-flex. Bonds at low temperatures; compatible with automated processes. Stored at room temperature.
8794 60 Silver-Coated Filler 1000 302 – 320 (150 – 160), 3-5 secs Good adhesion to substrates such as ABS, PVC and Melinex®, commonly used to bond and connect micromodules to antennae for Smart Card applications. Also ideal for any applications where fast bond times and reliable connections are required. Stored at room temperature.
9703 50 Silver-Coated Nickel 1000 59 – 158 (15 – 70), PSA Low outgassing version of 9705.
9705 50 Silver-Coated Nickel 1000 59 – 158 (15 – 70), PSA Good adhesion; reworkable. For connecting/bonding/grounding flex circuits, printed circuits boards, EMI/RFI shields & gaskets; PSA attachments at room temp. Not recommended for extreme high or low temps. Standard outgassing.