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Materials » 3M™ Electronics » 3M™ Copper Foil

Product Backing Adhesive Total Thickness mils (mm) Features Electrical Resistance m ohms Adhesion to Steel oz/in (N/cm) Product Certification
1125 1.4 mil copper foil Acrylic Non-Conductive 3.5 (0.089) For EMI shielding on a wide range of applications. Easily die cut. N/A 40 (4.4) UL 510
1126 1.4 mil copper foil Acrylic Conductive 3.5 (0.089) For EMI shielding, static charge draining when grounded. Easily die cut. 3 36 (3.9) MIL-T-47012
1181 1.4 mil copper foil Acrylic Conductive 2.6 (0.066) For EMI shielding, static charge draining, grounding. Easily die cut. 5 35 (3.8) UL 510
1182 1.4 mil copper foil Acrylic Conductive Coated on Both Sides 3.5 (0.089) Typically used to bond two surfaces, both physically and electrically. Also can provide EMI shielding, static charge draining, grounding. Easily die cut. 10 35 (3.8) UL 510
1183 1.4 mil tin-plated copper foil Acrylic Conductive 2.6 (0.066) Oxidation resistant for long-term EMI shielding, static charge draining, grounding. Solderable and easily die cut. 5 35 (3.8) UL 510
1194 1.4 mil copper foil Acrylic Non-Conductive 2.6 (0.066) For EMI shielding, static charge draining, grounding. Easily die cut. N/A 40 (4.4) UL 510
CU-35C 1.4 mil copper foil Acrylic Conductive 2.8 (0.07) For grounding and EMI shielding. Solderable and easily die cut. 5 35 (3.8) UL 510